About EMIE 2026
2026 6th International Conference on Electronic Materials and Information Engineering (EMIE 2026) will be held in Harbin, China from July 17 to 19, 2026. It is a leading conference for all researchers from different countries and territories to present their research results about Electron Devices and Mechanical Engineering.
The organizing committee invited a few accomplished experts in related research areas to give keynote speeches at the conference. All participants have a chance to discuss with the experts face to face, which will be definitely helpful for the participants to improve their study and research in the future. We warmly welcome prospective authors who are interested in the fields to submit their up-to-date and original research papers to the EMIE 2026 Organizing Committee to share their valuable experience with the leading researchers, scholars as well as experts of the fields around the world.
Important Dates
 | Full Paper Submission Date April 17, 2026 |
 | Registration Deadline July 3, 2026 |
 | Final Paper Submission Date July 10, 2026 |
 | Conference Dates July 17-19, 2026 |
Countdown
Conference Topics
Electronic materials
Physical chemistry, Semiconductor material, Conductive metals and their alloys, Electromagnetic shielding material, Dielectric material, Piezoelectric and ferroelectric materials, Magnetic material, Optoelectronic material, Integrated circuit
Information engineering
Electronic science and technology, Information and communication Engineering, Optoelectronic information science and technology, Engineering optics, Information optics, Electronic technology, Photoelectric technology, Communication technology, Measurement and control technology, Computer application technology
Contact
Conference Secretary: Summer Pan
Tel: +86-18922107265 (Wechat)
E-Mail: icemie2023@163.com
If you have any questions or inquiries, please feel free to contact us.